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At t4mation we are involved in developing next generation techniques for integration and fabrication of wireless micro-sensor architectures – power, signal processing/communication, and packaging.
Our emphasis is upon integration of highly miniaturized components, such as miniature IC's, passives, MEMS devices, opto-electronic elements, or microfluidic features into working systems that occupy volumes smaller than a sugar cube. This requires working with a wide variety of materials to fabricate features dimensions that may range between 5 microns and 1 millimeter.
There is no use of metal plating or etching processes or aggressive development chemicals in any fabrication step. Consequently fabrication is ecologically friendly and avoids the costs associated with waste stream treatment.
All substrate fabrication steps can be defined by a single CAD drawing, and no masks are required. This CAD-to-Fab capability allows rapid design changes for fast product development and is amenable to small batch production. In high-volume production, parallel processing concepts provide competitive processing costs.
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